Introduction
Complete Guide to PCB Strain Gage Testing for BGA Reliability - PCBSync
: Standardizes where and how to attach strain gages (typically near corners of large components like BGAs). Test Setup ipc-9704 pdf
SMT Assembly: Board splitting (depanelization), connector installation, and manual handling.
One of the key areas covered in this standard is Pin-in-Paste (PIP) technology (also known as Intrusive Reflow). This technique allows through-hole components to be soldered during the reflow process, eliminating the need for wave soldering. The IPC-9704 PDF outlines the design rules, stencil requirements, and process parameters to make PIP successful. Introduction Complete Guide to PCB Strain Gage Testing
Scope
Sampling Rate: A minimum frequency of 500 Hz to 2 kHz is recommended to capture transient events like vacuum engagement in ICT fixtures. Critical Manufacturing Processes to Monitor Pin-in-Paste (PIP) Guidelines One of the key areas
IPC/JEDEC-9704 (officially IPC/JEDEC-9704A ) is the "Printed Wiring Board Strain Gage Test Guideline." It provides standardized procedures for measuring mechanical strain on printed circuit boards (PCBs) to prevent damage to solder joints and components like BGAs during manufacturing and testing. National Instruments Direct Paper and Resource Links